YAMAHA 3D Hybrid Module Mounter S20
Date:2020-11-20    Hits:821
Can achieve 3D MID ※ mounting to achieve universality Expandable to mount 3D MID to enhance substrate response capabilities Flexible component/variety response ability, versatility, and switchability ※ 3D MID: 3D Molded Interconnect Device

1. Can achieve 3D mixed mounting


By adopting a newly developed dispensing head that can be interchanged with the mounting head, it is possible to achieve 3D mounting through interactive implementation of solder paste dispensing and component mounting, achieving mixed mounting.


The testing dispensing station can be disassembled and assembled on the fixed frame of the feeder.



2. Scalable to 3D MID mounting


In order to avoid being limited to regular substrate production and enable the equipment to perform solder paste dispensing and component mounting on three-dimensional objects with different heights, angles, and directions such as concave and convex surfaces, inclined surfaces, and curved surfaces, promoting the development of new models.


In the future, 3D MID production can be implemented for vehicles/medical devices, communication machines, etc. that were previously difficult to handle.



3. Enhanced substrate corresponding ability



4. Flexible component/variety corresponding ability



5. Highly versatile production interchangeability

The new refueling trolley that can install 45 feeder tracks can be mixed with existing refueling carts for use

SURFACE MOUNT EQUIPMENT HYBRID MOUNTING EQUIPMENT SOLDER PASTE PRINTER YAMAHA DISPENSER AOI SPI 其他检查装置 REFLOW CLEANING EQUIPMENT INKJET PRINTER STORAGE SYSTEM PARTS SUPPORT SYSTEMS AND SOFTWARE

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