1. Faster and more accurate inspection
Faster 3D inspection 56.8cm2/s
Higher precision 3D inspection of 8-direction projection device
4-way squint camera with 20 million pixels for image inspection
Equipment Inspection High Level Resolution 5 μ M/Coaxial lighting
2. Support inspections in the semiconductor field
3. Strengthen substrate transport capability
4. New Software Solutions for Effectively Utilizing AI